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Thermo-Bond 54 is recommended for high temperature aerospace and electronic applications where the combination of good thermal conductivity AND low electrical conductivity is required for thermal links (staking electrical components -- diodes, integrated circuits, transistors, precision resistors, or capacitors -- to chassis or circuit boards). This two-part thixotropic epoxy system is color coded for easy handling and mixing at room temperature -- although a final high temperature bake at 100C is REQUIRED for full cure. Thermo-Bond 54 bonds strongly to ceramics (alumina, porcelain and beryllia), to glass and to many metals and plastics, and its thermal expansion coefficient is a good match for many other electronic materials (i.e. copper and aluminum) over a wide temperature range. The fully cured adhesive develops strong, durable electrically insulating/thermal conductin
- Apperance - Grey
- Cure Type - Heat Cure
- Viscosity - 120000
- Dissipation Factor -
- Operating Temp - from â€"50 to +160°C
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